SmolINCO™

CNFs enhance today’s Cu-pillar interconnect technology by improving the reliability of the solder joint, particularly in the intermetallic alloy region at the interface between the two pillars. The solder wetting properties of metal-coated CNF efficiently confine the solder to the volume of the CNF-based microbump by capillary effect, allowing for smaller bump sizes, finer pitches and improved production yield. CNF-based microbumps improve the alignment between adjacent chips by its excellent solder wetting properties. Nanoscale thermal conduction path significantly enhances heat dissipation from the packaged chips.

The SmolINCO™ improves the overall performance and reliability of existing Cu-based microbump technology and smoothens the scaling path down to ~5μm pitch, and beyond that solder free thermal compression bonding.