Laser Cutting and Drilling System for Sapphire

Model: Fiber Laser Cutting and Drilling System for Sapphire ◆Size of working area: 200mm*200mm (customizable) ◆Processing speed: 500mm/s ◆Cutting time: <1min for cutting the outline and internal hole slot of a 5-inch smartphone’s cover glass ◆Processable material thickness: 0.1-2mm ◆Minimum processing radius: 0.2mm ◆Edge chipping: <50μm (average of 20μm) ◆Processable materials: A, C double crystal cast slice and non-cast slice ◆Applications: Processes the entire outer shape and inner features of camera lenses, smartphone panels, and watch panels all at once. Model: Picosecond Laser Micro-Cutting and Drilling System for Sapphire ◆Size of working area: 200mm*200mm (customizable) ◆Processing speed: 300mm/min ◆Cutting time: <5s for camera lens of φ5mm ◆Processable material thickness: 0.1-1mm ◆Minimum processing radius: 0.1mm ◆Edge chipping: <10μm ◆Processable materials: A, C double crystal cast slice and non-cast slice ◆Applications: Micro-processing of holes in camera lenses and other optical lenses. Model: Lossless Laser Micro-Cutting & Drilling System for Sapphire ◆Size of working area: 200*200mm (customizable) ◆Processing speed: 500mm/s ◆Processable material thickness: 0.1-1mm ◆Minimum processing radius: 0.1mm ◆Edge chipping: <10μm ◆Processable materials: A, C double crystal cast slice ◆Applications: Lossless cutting of sapphire-coated parts; rapid cutting of sapphire LED packaging

Model-1: Fiber Laser Cutting and Drilling System for Sapphire Model-2: Picosecond Laser Micro-Cutting and Drilling System for Sapphire Model-3: Lossless Laser Micro-Cutting & Drilling System for Sapphire