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Registration Date 30 Apr 2017

FCOL

Electronics Sensor

Sensor

Applications

There are a wide range of applications for FCOL and some examples are : Wireless Devices Power Management Devices High-speed Network Devices
Wireless sensors Power Management

Manufacturer's Description

Carsem's patented FCOL (Flip Chip On Leadframe) is the process of flipping a bumped die onto a lead frame and then molding it using standard plastic package assembly processes. FCOL™ is available in standard packages such as MLP, SOT23, SC70, TSOT, QSOP and narrow body SOICs.  Features : Same package with up to 4X larger dieMSL Level 1*60% improvement in self-inductance and capacitance15% lower thermal resistance30x reduction in resistance vs wire bondWithstands 260°C solder shock testAbility to final test including RF