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Jetart Technology Co., Ltd

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  • 1Industry

About Company

Jetart Technology has been established in 1989, and since then concentrated on developing "Thermal Solution" and "Computer Peripherals ". Jetart Technology has certified by ISO9001 in 2001. We created the brand name JETART and marketingthe global sales channel in 2005. For the quality, service and the spirit of innovation we insist on setting up our manufactory in Taiwan and create one continuous line from R&D, manufacture, and quality assurance to

Jetart Technology has been established in 1989, and since then concentrated on developing "Thermal Solution" and "Computer Peripherals ". Jetart Technology has certified by ISO9001 in 2001. We created the brand name JETART and marketingthe global sales channel in 2005. For the quality, service and the spirit of innovation we insist on setting up our manufactory in Taiwan and create one continuous line from R&D, manufacture, and quality assurance to marketing strategy; meanwhile, with the production of million pieces per year allows us to share the competitive advantage with our customers. In our belief of nonstop innovation we now are focusing on developing Notebook and Tablet Computer Peripherals. Now we already acquired the hundred of patent of new product; moreover we passed the international standard of famous companies and became their ODM manufactory. We pay attention to the each detail of product design, manufacturing technology and quality control because we want to make all products to satisfy with our customer’s requirement.

Products

Nano-Silver Thermal Compound

OTHERS - OTHER PRODUCTS   |  CONDUCTIVE THERMAL COMPOUND

Ag Nano-Silver Thermal Compound

Properties :

Thermal Conductivity
Nano Diamond Thermal Compound

OTHERS - OTHER PRODUCTS   |  CONDUCTIVE THERMAL COMPOUND

C Nano Diamond Thermal Compound

Properties :

Thermal Conductivity

Application :

Electronics,Chips,Heat sink
Nano Carbon Thermal Compound

OTHERS - OTHER PRODUCTS   |  CONDUCTIVE THERMAL COMPOUND

C3N4 Nano Carbon Thermal Compound

Properties :

Thermal Conductivity

Analytical Reports