Registration Date 22 Feb 2022
Revision Date 22 Feb 2022

Silver Conductive Ink


Printing Ink

Conductive Ink


Manufacturer Asserted


Ag Nanoparticle /Nanopowder CAS Number : 7440-22-4


Smartphone, Tablet OLED Touchscreen 3D printing Battery


Electrical Conductivity Printability

Manufacturer's Description

There are many types of conductive ink available in the market, but the silver conductive ink is the best in terms of conductivity and printability. This product formulation manufactured from three main components, such as Silver (Ag) nanopowder, adhesive or binder polymer, and solvent. It is also known as Nano-silver printing ink.
It primarily used for flexible substrate printing, where it screen printed on the insulated surface of the plastic, PET, acrylic, and many other plastic components to make a conductive circuit. Since the electronics devices require multiple interconnect and electrode, hence the silver ink is the best solution to fulfill its requirements. The viscosity plays a vital role in inject and screen printing, which can be optimized through the concentration of solvent and patented adhesive.
Our silver conductive ink dried at room temperature with excellent curing time, whereas the flexibility of a substrate does not affect after getting cured. The resistivity of ink is less than 0.003 ohms/ The researchers may calculate the resistivity by using the 4 probe method. The used adhesive is itself conductive; hence the silver conductive paste is highly durable and conductive. We also supply the silver ink conductive pen.
The silver used in ink is 99.9% pure nanopowder with uniform particle size. The loading percentage varies as per the application. It majorly used for wearable electronics, touchscreens, smartphones, 3D printing, OLEDs, battery electrodes, membrane circuits, printed circuit boards (PCB), Switchable films, and many more. It also used in inkjet printing technology. Some people used it for their existing printers with slight modifications. In many places, it used for indirect soldering applications where it places as a sandwich between the insulated substrate and copper tape.