AQM H-SiOx

AQM has developed a convenient and versatile method to synthesize an electronic grade of silsesquioxane-based (comprised of silicon and oxygen core, H-SiOx) resin. This class of polymer/resin is a very efficient negative photo- and electron-beam resist for nanolithography device fabrication. Our H-SiOx brand polymers have optimum molecular weight to make a homogenous solution in common organic solvents (e.g., toluene and methyl isobutyl ketone) for thin-film fabrication. Depending on the film thickness, a dense pattern with sub-10 nm half-pitch can be achieved. Our quality control process, packaging, and storage ensures that H-SiOx has a long shelf-life that maintains its contrast performance over time.