| Intel |
Electronics Processor Product Number : Celeron G1101
ProcessorLithography 32 nm Instruction Set 64-bit # of Processing Die Transistors 177 million
Specifications
| -Essentials | ||
| Status | Launched | |
| Launch Date | Q1'10 | |
| Processor Number | G1101 | |
| Intel® Smart Cache | 2 MB | |
| DMI | 2.5 GT/s | |
| Instruction Set | 64-bit | |
Embedded Options Available | Yes | |
| Lithography | 32 nm | |
| Recommended Customer Price | TRAY: $85.00 | |
| Datasheet | Link | |
| -Performance | ||
| # of Cores | 2 | |
| # of Threads | 2 | |
| Processor Base Frequency | 2.26 GHz | |
| TDP | 73 W | |
| -Memory Specifications | ||
| Max Memory Size (dependent on memory type) | 16 GB | |
| Memory Types | DDR3 1066 | |
| Max # of Memory Channels | 2 | |
| Max Memory Bandwidth | 17 GB/s | |
| Physical Address Extensions | 36-bit | |
| ECC Memory Supported ‡ | Yes | |
| -Graphics Specifications | ||
| Graphics Base Frequency | 533 MHz | |
| Intel® Flexible Display Interface (Intel® FDI) | Yes | |
| Intel® Clear Video Technology | No | |
| # of Displays Supported ‡ | 2 | |
| -Expansion Options | ||
| PCI Express Revision | 2.0 | |
| PCI Express Configurations ‡ | 1x16, 2x8 | |
| Max # of PCI Express Lanes | 1 | |
| -Package Specifications | ||
| Max CPU Configuration | 1 | |
| Package Size | 37.5mm x 37.5mm | |
| Processing Die Size | 81 mm2 | |
| # of Processing Die Transistors | 382 million | |
| Graphics and IMC Lithography | 45 nm | |
| Graphics and IMC Die Size | 114 mm2 | |
| # of Graphics and IMC Die Transistors | 177 million | |
| Sockets Supported | FCLGA1156 | |
| Low Halogen Options Available | See MDDS | |
| -Advanced Technologies | ||
| Intel® Turbo Boost Technology ‡ | No | |
| Intel® vPro Technology ‡ | No | |
| Intel® Hyper-Threading Technology ‡ | No | |
| Intel® Virtualization Technology (VT-x) ‡ | Yes | |
| Intel® Virtualization Technology for Directed I/O (VT-d) ‡ | No | |
| Intel® VT-x with Extended Page Tables (EPT) ‡ | Yes | |
| Intel® 64 ‡ | Yes | |
| Idle States | Yes | |
| Enhanced Intel SpeedStep® Technology | Yes | |
| Intel® Demand Based Switching | No | |
| Thermal Monitoring Technologies | No | |
| -Intel® Data Protection Technology | ||
| Intel® AES New Instructions | No | |
| -Intel® Platform Protection Technology | ||
| Trusted Execution Technology ‡ | No | |
| Execute Disable Bit ‡ | Yes | |
