| Microsemi |
Electronics Integrated Circuits Product Number : 1100-1039-ND
Integrated Circuits (ICs)Low Power Small Footprint Packages Wide Range of Features Reprogrammable Flash Technology In-System Programming (ISP) and Security
Low density CPLD replacement FPGA with small package footprint Microsemi’s innovative ProASIC3 nano devices bring a new level of value and flexibility to high-volume markets. When measured against the typical project metrics of performance, cost, flexibility and time-to-market, the ProASIC3 nano devices provide an attractive alternative to ASICs and ASSPs in fast moving or highly competitive markets. Customer-driven total system cost reduction was a key design criteria for the ProASIC3 nano program. A single-chip implementation and a broad selection of small footprint packages, all contribute to lower total system costs.
ELECTRONICS - INTEGRATED CIRCUITS
Properties : Wide Range of Featur,Reprogrammable Flash,In-System Programmin,Low power consumptio,Small Footprint Pack
Application : Networking/communica,Avionics markets,Computing
ELECTRONICS - INTEGRATED CIRCUITS
Properties : Wide Range of Featur,Reprogrammable Flash,In-System Programmin,Low power consumptio,Small Footprint Pack
Application : Computing,Networking/communica,Avionics markets
ELECTRONICS - INTEGRATED CIRCUITS
Properties : Small Footprint Pack,Wide Range of Featur,Reprogrammable Flash,In-System Programmin,Low power consumptio
Application : Avionics markets,Computing,Networking/communica
ELECTRONICS - INTEGRATED CIRCUITS
Properties : Wide Range of Featur,Reprogrammable Flash,In-System Programmin,Low power consumptio,Small Footprint Pack
Application : Networking/communica,Avionics markets,Computing
ELECTRONICS - INTEGRATED CIRCUITS
Properties : Wide Range of Featur,Reprogrammable Flash,In-System Programmin,Low power consumptio,Small Footprint Pack
Application : Computing,Networking/communica,Avionics markets
