Digital MEMS Vibration Sensor with Embedded RF Transceiver

Vibration analysis Condition monitoring Machine health Instrumentation and diagnostics Safety shutoff sensing

Wireless vibration system, 902.5 MHz to 927.5 MHz Clear Channel Assessment and packet collision avoidance Error detection and correction in radio frequency (RF) protocol Programmable RF Output power Sensor Node (ADIS16229) Dual-axis, ±18 g MEMS accelerometer 5.5 kHz sensor resonant frequency 37.8 mm × 22.8 mm × 13.5 mm MCML package (ADIS16229) Single-supply operation: 3.0 V to 3.6 V Operating temperature range: −40°C to +85°C See data sheet for additional features

Analog Devices accelerometers and iSensor® MEMS accelerometer subsystems provide accurate detection while measuring acceleration, tilt, shock, and vibration in performance driven application. Our portfolio leads the industry in power, noise, bandwidth, and temperature specifications, and offers a range of MEMS sensor and signal conditioning integration on chip. Our MEMS-based Circuits from the Lab® reference designs have been built and tested by ADI experts to help you jumpstart your next system design.

The ADIS16000 and ADIS16229 enable the creation of a simple wireless vibration sensing network for a wide variety of industrial equipment applications. The ADIS16000 provides the gateway function, which manages the network, while the ADIS16229 provides the remote sensing function.The ADIS16229 iSensor® is a complete wireless vibration sensor node that combines dual axis acceleration sensing with advanced time domain and frequency domain signal processing. Time domain signal processing includes a programmable decimation filter and selectable windowing function. Frequency domain processing includes a 512-point, real valued fast Fourier transform (FFT); FFT magnitude averaging; and programmable spectral alarms. The FFT record storage system offers users the ability to track changes over time and capture FFTs with multiple decimation filter settings.
The dynamic range, bandwidth, sample rate, and noise perfor-mance of the ADIS16229 are well suited for a wide variety of machine health and production equipment monitoring systems. This device also provides a number of wireless configuration parameters, enabling a wide level of flexibility in managing the trade-off between battery life and communication frequency.
The ADIS16000 serial peripheral interface (SPI) provides simple connectivity with most embedded processor platforms, and the SMA connector interface enables the use of many different anten-nas. This module supports up to six ADIS16229 devices at one time, using a proprietary wireless protocol.
The ADIS16000 module is available in a 37.8 mm × 22.8 mm × 8.8 mm multichip chip module laminate (MCML) structure, and the ADIS16229 is available in a 37.8 mm × 22.8 mm × 13.5 mm MCML structure. Both have an SMA connector for simple antenna connection, have two mounting holes for simple installation, and support operation over a −40°C to +85°C temperature range. The ADIS16000 also includes a standard 1 mm, 14-pin connector for connecting to an embedded processor system. The ADIS16229 provides a lead structure that enables simple connection with battery leads.