|China Wafer Level CSP Co., Ltd.|
Ultra-thin module height Small form factor (X,Y,Z) Performance enhancement Scratch resistant JEDEC Level 1 moisture sensitivity
Consumer's growing need for an improved security solution in their personal mobile electronic has kick started a huge demand for an integrated ultrathin fingerprint module. To satisfy the consumer's demand for electronic security through the use of fingerprint methodology, China Wafer Level CSP Co., Ltd. has developed the world's first ETIM™ (Edge Trench Interconnect Module) technology. ETIM™ solution also includes wafer level interconnect methods, advanced module manufacturing and many other sophisticated sensor packaging related technologies. ETIM™ is the most advanced fingerprint sensor module technology currently available. The ETIM™ innovative concept offers smaller form factor, exceptional reliability, unmatchable sensor functionality and performance than any other existing solutions. The ETIM solution also enables the original equipment manufacturers (OEMs) and the sensor module manufacturers to innovate novel mobile electronics that are much lower profile, thinner and more sophisticated than ever before.Compliance with JEDEC Level 1 moisture sensitivity requirements makes this exciting new technology suitable for automotive and other market segments that requires higher level of device reliability.