Mobile Imaging

Ultra-thin module height Small form factor (X,Y,Z) Performance enhancement Standard SMT assembly Enables 3D stacking with ISP/DSP Compatible with reflowable wafer-level cameras Available in both cavity and non-cavity formats, and lead and lead-free bumps format JEDEC Level I, II & III moisture sensitivity

As consumers continue to demand smarter, higher quality, thinner mobile cell phone cameras and other portable camera enabled devices, manufacturers face the challenge to miniaturize camera modules and improve quality. To meet this challenge, they require image sensor packaging technology that delivers smaller form factor and greater reliability.China Wafer Level CSP Co., Ltd. has developed the world's smallest TSV CSP (Through Silicon Via Chip Size Package) packaging technology that eliminate the yield penalty coming from the multi-step process of assembling conventional camera modules. As a result, manufacturers achieve thinner, more reliable and less costly imaging solutions.China Wafer Level CSP technology is the industry's first commercially available 300mm wafer-level packaging solution for CMOS and CCD image sensors. This technology allows for increasingly smaller form factors using Through Silicon Vias (TSVs), and a cavity glass-silicon sandwich structure to improve reliability and yield for camera module manufacturers.