Fully-Automatic Laser Cutting and Sorting System for FPC

◆This machine is mainly used for cutting fingerprint identification module ICs/FPCs and camera module FPCs.

◆Automatic dual-position laser processing ◆Automatically loading from workpiece tray stack ◆Automatic unloading of cut products onto tray ◆Unloading trays are automatically arranged in a stack ◆Automatically detects and skips cutting of defected material that has been marked ◆Cutting dimensional accuracy: ±30μm ◆Edge chipping: <20μm ◆Max. UPH: >3000

This fully-automated machine uses a high-power UV laser to cut entire sheets of FPCs. After cutting, the individual pieces are automatically sorted and arranged on carrier trays for further downstream processing.
◆Size of working area: (250mm*100mm)*2
◆Applicable materials: <0.8mm thick PCB, FPC, cover film, FP4, composite materials; <0.3mm thick sapphire
◆Laser focal spot diameter: 20-30μm
◆Processing speed: 1.2 s/pcs;
◆Max. UPH>300
◆Cutting size precision: ±50μm
◆Edge chipping: zigzag <30μm
◆Sorting positional accuracy: ±0.1μm
◆Applicable shapes: straight lines, oblique lines, and curves