Registration Date 30 Apr 2017

(Silicon on Insulator) SOI Waf


Others Other products

Polished wafer


MEMS Integrated circuit

Manufacturer's Description

Most commonly used in MEMS and advanced CMOS integrated circuit fabrication, SOI wafers provide a manufacturing solution which helps reduce power and heat while increasing the speed performance of a device. SOI wafers are a three layer material stack composed of the following: Active layer of prime quality silicon (DEVICE LAYER) over a buried layer(BOX) of electrically insulating silicon dioxide, over a bulk silicon support wafer (HANDLE). SOI wafers are unique products which are custom built for specific end-user applications. SICREAT offers two types of SOI: Thick Film and Thin Film.
Specifications:Thick Film                                                                      Thin FilmMaterial: Silicon                                                              Material: SiliconWafer Diameter: 76.2mm (3”) to 200mm (8”)                  Wafer Diameter: 150mm (6”), 200mm (8”)Type/Dopant: N or P                                                       Type/Dopant: N or PDevice Layer Thickness: >1.5um                                    Device Layer: >20nm (0.02um)
    Cz and Fz grown silicon SOI    Single side polish and double side polish    Prototype and production volumes    Consistent, reliable production supply line    Competitive pricing    Excess inventory