Double Side Polished Wafer

SICREAT’s product line includes both single side polished (SSP) and double side polished (DSP) wafer substrates. Double side polished wafers are typically required in semiconductor, MEMS, and other applications where wafers with tightly controlled flatness characteristics are required. They are also needed for double side patterning and device manufacturing projects.SICREAT carries a large inventory of double side polished wafers in all wafer diameters ranging from 50mm to 300mm. If your specification is not available in inventory SICREAT can custom manufacture wafers to your unique specifications. Double Side polished wafers are available in silicon, glass and other materials commonly used in the semiconductor industry.