SiP

There is an almost endless list of potential SiP applications and some examples are : BluetoothTM Wireless Devices 802.11 WLAN Applications Power Management Devices GPS Modules Internet Mini-Systems

Carsem's SiP(System in Package) is the advanced technology of placing multiple ICs and passive components into a single package. Our services include design, modeling as well as final test including RF testing of Bluetooth and WLAN applications.  Features : Package construction : Leadframe and Laminate basedPackage size up to 12x12 mmTerminal Pitches as fine as 0.4mmPackage Thickness from 0.5 mm to 2.5 mmFlip chip, wire bond and stacked die capabilitiesAbility to mount passive components as small as 0201