FCOL

There are a wide range of applications for FCOL and some examples are : Wireless Devices Power Management Devices High-speed Network Devices

Carsem's patented FCOL (Flip Chip On Leadframe) is the process of flipping a bumped die onto a lead frame and then molding it using standard plastic package assembly processes. FCOL™ is available in standard packages such as MLP, SOT23, SC70, TSOT, QSOP and narrow body SOICs.  Features : Same package with up to 4X larger dieMSL Level 1*60% improvement in self-inductance and capacitance15% lower thermal resistance30x reduction in resistance vs wire bondWithstands 260°C solder shock testAbility to final test including RF