About Company
China Wafer Level CSP Co., Ltd. (SSE: 603005) was founded in Suzhou in 2005 with a vision on developing innovative technologies and assisting its customers in implementing high-volume manufacturing of reliable, miniaturized, high-performance and cost-effective semiconductor packages. China Wafer Level CSP’s CMOS Image Sensor Chip-Scale Package technology revolutionized the packaging world, helping make the high-performance, miniaturized mobile camera
China Wafer Level CSP Co., Ltd. (SSE: 603005) was founded in Suzhou in 2005 with a vision on developing innovative technologies and assisting its customers in implementing high-volume manufacturing of reliable, miniaturized, high-performance and cost-effective semiconductor packages. China Wafer Level CSP’s CMOS Image Sensor Chip-Scale Package technology revolutionized the packaging world, helping make the high-performance, miniaturized mobile camera modules of today possible. The value of this approach has allowed it to become one of the most widely proliferated packaging technologies in history, finding use with nearly 50% of today’s image sensor chips, and with a wide range of semiconductor devices that are ubiquitous in smartphones, tablets, wearables and other electronics. This focus on technology innovation continues today at China Wafer Level CSP and through our Optiz Inc. subsidiary located in Palo Alto, CA.
